Bob Hicks, PhD, Surf X Technologies
Surfx’s atmospheric-pressure process offers multiple advantages over older vacuum technology. First and foremost, our plasma can be integrated into other equipment, such as thermocompression bonders, inkjet printers, and molding machines, for “just in time” cleaning. The high pressure means there are thousands of times more active species reaching the surface to remove unwanted oxidation or organic contamination. Throughputs are perfectly well suited for high-volume production. Furthermore, one machine can easily handle different substrates, ranging from a single die on a complex package to one-meter-squared glass panels.
Surfx’s STW-10 wafer processing tool is especially well suited for hybrid bonding. The machine quickly activates PECVD glass for direct bonding without adding any particles to the surface. Class 10 operation is standard. These machines are configured for treating both die on tape frame (supplied in cassettes) and 300 mm wafers (supplied in front opening universal pods (FOUPS)). The gentle nature of the downstream plasma and the rapid scanning over the substrate surface make it an ideal choice for processing dies on tape frame.
The company’s commitment to safety, efficiency and sustainability is reflected in their core plasma technology which is built on low-voltage RF power and argon gas supply. Surfx’splasma systems minimize waste generation, reduce chemical usage, and promote a green manufacturing environment.
