Interview with Jim Angeloni, NEOTech’s Microelectronics Process Engineering Fellow
A leading provider of high-reliability microelectronics, NEOTech specializes in the design, engineering, and manufacturing of advanced microelectronic assemblies. With a strong emphasis on innovation, NEOTech delivers cutting-edge solutions for Aerospace & Defense, ensuring precision and quality in every product. The company’s expertise in microelectronics enables it to exceed the stringent requirements of mission-critical applications, making it a trusted partner for complex and high-performance projects. NEOTech’s commitment to excellence drives continuous advancements in microelectronics technology, positioning the company at the forefront of the industry. We sat down with Jim Angeloni, NEOTech’s Microelectronics Process Engineering Fellow, one of NEOTech’s most experienced technical experts – a veteran process engineer and industry thought leader – to gain insight into the company’s approach to microelectronics and how it continues to evolve with the industry.
Q: NEOTech has a strong reputation in microelectronics for the Aerospace & Defense sector. How has the company successfully grown/evolved its capabilities in this area over the years?
A: It has really been a steady, deliberate progression. We’ve added capabilities over the years as customer needs changed, and technologies advanced by putting the right infrastructure in place and making sure our processes matured alongside it. Our cleanrooms, automated wire bonders, and inspection systems are world-class now, but they didn’t show up overnight. We’ve been building toward this for decades, investing in the people and systems to make it sustainable. In addition, I think what’s helped is that we’ve kept the focus on doing the hard things right—where precision really matters.
Q: We understand that NEOTech’s equipment and people are some of the best available and, as a result, the company offers superior results. Can you explain some key factors that differentiate your microelectronics services from those of your competitors?
A: From my point of view, it is the attention to detail and the pride the teams take in their work. Our operators and engineers treat every unit like it’s going into something that someone’s life might depend on—which, honestly, is often the case in this industry. We do not rush. We verify. We’ve also built a strong culture of ownership. Our people are empowered to get everyone’s attention if they notice a problem. And while we’ve got the tools (below), it’s the judgment of experienced hands that still makes the difference.
· Automatic high precision die attach
· Automatic interconnect (Wire & Ribbon bond)
· Automatic inspection
· Semi-automatic Laser & Linear seal
· Laser & Ink Jet Marking
· Automatic Test & Tune
Q: With rapid advancements in microelectronics technology for the Aerospace & Defense sector, how does NEOTech ensure it stays at the forefront of innovation?
A: I have always believed that innovation doesn’t have to mean big leaps—it can be small improvements that add up. We’ve been fortunate to have leadership that supports internal experimentation. For example, we implemented a modified wire bonding method—Standoff Stitch, or SOS bonding—which added reliability margin where it counted. That came from our own engineers looking at real-world failures and asking, “How do we do better?” We’re not about the quick and temporary fixes here. We’re trying to quietly improve yield, robustness, and process control every day.
Q: How is NEOTech leveraging emerging technologies such as AI, IoT, and 5G in your microelectronics manufacturing processes for Aerospace & Defense customers?
A: In the kind of work we do—military-grade hybrid circuits, hermetic packages—there’s a lot of sensitivity around where and how technologies are applied. That said, we’ve definitely found value in machine-level data collection and analysis. For instance, we use statistical trends from our bonders and inspection systems to identify issues before they become defects. It’s more about stability than speed. We’re also building the electronics for systems that incorporate AI and advanced communications, so our job is to make sure those assemblies are rock-solid from the ground up.
Q: What major trends do you see shaping the future of microelectronics, and how is NEOTech positioning itself to address them?
A: Miniaturization is going to keep pushing limits and so will thermal and electrical performance requirements. What we’re seeing is a move toward more integration in smaller packages, which challenges both assembly and inspection. We’re responding by refining our process windows, qualifying new materials, and adding automation in smart ways. At the same time, the need for trusted domestic manufacturing is growing. NEOTech is well-positioned for that, with multiple certified sites and a lot of tribal knowledge that frankly you don’t find just anywhere anymore.
Q: As the demand for miniaturization and higher functionality increases in the Aerospace & Defense sector, how is the company adapting its microelectronics solutions to meet these market needs?
A: We’re building assemblies now that we wouldn’t have attempted 10 years ago—multi-die, fine-pitch, complex interconnects—all in very tight footprints. That’s taken a lot of internal cross-training and process refinement. We’ve made sure our bonding and die attach processes can handle smaller geometries, and we’ve beefed up our inspection protocols to make sure nothing escapes detection. It’s not just about shrinking the package—it’s about maintaining or improving reliability as you do it. That’s where the real work is.
Q: Quality and reliability are paramount in microelectronics. How does NEOTech ensure the highest standards in your manufacturing processes?
A: We don’t take shortcuts, and we build checks into everything. Our processes follow military standards like MIL-PRF-38534 and MIL-STD-883, and we’ve got a full suite of inspections—visual, X-ray, pull and shear testing, and so on. But what really matters is the mindset. Our teams are trained to understand why every step matters, not just how to do it. That understanding builds consistency. We’ve also had success with using process data and lessons from test escapes to feed back into training and continuous improvement. The standards are the floor. We always try to build higher than that.
Q: What steps does NEOTech take to mitigate risks related to component failure and ensure long-term reliability in your microelectronics products?
A: It starts with procurement and supplier controls. We only buy from qualified sources, and everything gets verified on arrival. Once we’re in assembly, it’s about protecting the components from stress—whether that’s thermal-, mechanical-, or contamination-related. Hermetic sealing, bakeouts, cleanroom handling—all of those play a role. We also do a lot of environmental stress testing—thermal cycling, burn-in, and so forth—to make sure what we’re building will hold up. And if anything goes wrong, we have internal failure analysis tools to root out the cause and make adjustments fast.
Q: Looking ahead, what are the company’s strategic goals for expanding and enhancing its microelectronics capabilities, especially for the Aerospace & Defense sector?
A: We’re continuing to invest in cleanroom capacity, adding tools that improve both throughput and repeatability. But I’d say one of the biggest focuses is on training and knowledge transfer. The kind of work we do doesn’t live in textbooks—it’s learned by doing, and we’re putting a lot of effort into mentoring the next generation of microelectronics engineers and technicians. We’re also getting more involved earlier in the product development cycle, which helps avoid costly redesigns later. The better we understand the application, the better we can build to support it.
