by admin | Aug 29, 2022 | August ‘22 Article
Breakthrough in Advanced Semiconductor Packaging: Hydrogen Plasma Cleaning of Copper and Tin for Flux-Free Flip Chip and Hybrid Bonding For advanced 3D IC integration, two technologies are being developed to bond chips together: flip-chip micro-bumps and hybrid...
by admin | Aug 29, 2022 | August ‘22 Interview
Interview with Doug Dow, Absolute EMS Absolute EMS, located in the heart of Silicon Valley, is a leader in offering manufacturing services in a state-of-the-art, high-technology EMS facility. Founded in 1996, the company originally serviced the medical industry, thus...
by admin | Aug 29, 2022 | August ‘22
How Semiconductors Will Drive EV Growth The electric vehicle (EV) market has reached an inflection point, transitioning from a niche low-volume sector to a high-volume mass market. Right now, supply is constrained, and car makers can sell every EV they make, but this...
by admin | Aug 29, 2022 | August ‘22
U.S. Semiconductor Renaissance: All the Upcoming Fabs Everything we know about new chip manufacturing facilities in America. The U.S. share of global semiconductor manufacturing capacity has decreased from 37% in 1990 to 12% in 2021, according to the Semiconductor...
by admin | Aug 29, 2022 | August ‘22
The mother of all ‘zero-days’ — immortal flaws in semiconductor chips The CHIPS Act of 2022 was signed into law on Aug. 9. It provides tens of billions of dollars in public support for revitalization of domestic semiconductor manufacturing, workforce training, and...
