by admin | Sep 14, 2022 | Sep ‘22
GlobalWafers asked to delay shipments ‘FINE-TUNING’: Customers have asked the company to postpone the delivery of some products from the end of this year to early next year amid flagging demand GlobalWafers Co (環球晶圓) yesterday said its customers asked it to put off...
by admin | Sep 14, 2022 | Sep ‘22
U.S. curbs on chip tool sales to China won’t hurt Taiwan much: Economist A reported move by the Joe Biden administration to introduce broader curbs on the sale of U.S.-made IC chips and production equipment to China is likely to have a limited impact on...
by admin | Sep 14, 2022 | Sep ‘22
First Nvidia Hopper Benchmark Tests Newest MLPerf inferencing results include tests of new chips, slimmed-down neural nets It’s time for the “Olympics of machine learning” again, and if you’re tired of seeing Nvidia at the top of the podium over and over, too bad. At...
by admin | Aug 30, 2022 | August ‘22 Feat PR
CyberOptics to Deliver Technical Presentation at the Heterogeneous Integration Summit by SEMICON Taiwan The company will also unveil new WaferSense® and ReticleSense® Auto Teach Systems™ (ATS2™ and ATSR™) CyberOptics® Corporation, a leading global developer and...
by admin | Aug 29, 2022 | August ‘22 Article
Breakthrough in Advanced Semiconductor Packaging: Hydrogen Plasma Cleaning of Copper and Tin for Flux-Free Flip Chip and Hybrid Bonding For advanced 3D IC integration, two technologies are being developed to bond chips together: flip-chip micro-bumps and hybrid...
