The Worldwide Outsourced Semiconductor Assembly and Testing Industry is Projected to Reach $60.3 Billion by 2031 at a 6.32% CAGR – ResearchAndMarkets.com

The “Outsourced Semiconductor Assembly and Testing Market By Process, By Packaging Type, By Application: Global Opportunity Analysis and Industry Forecast, 2021-2031” report has been added to ResearchAndMarkets.com’s offering.

The global outsourced semiconductor assembly and test market was valued at $34,553.5 million in 2021, and is projected to reach $60,334.5 million by 2031, registering a CAGR of 6.32% from 2022 to 2031.

Outsourced semiconductor assembly and test (OSAT) are the number of companies that offers third-party IC-packaging as well as test services. IDMs and foundries often outsource a certain percentage of their IC-packaging production to OSATs with internal packaging operations.

OSAT mainly emphasizes on providing advanced packaging as well as test solutions for semiconductor companies in various markets such as consumer goods, communications, and computing along with emerging markets such as Internet of Things (IoT), automotive electronics, and wearable devices.

The global outsourced semiconductor assembly and test market is mainly driven by increase in demand for consumer electronics and surge in degree of urbanization. In addition, increase in adoption of smartphones significantly fuels the market growth. However, high cost associated with OSAT services may hamper growth of the market during forecast period. On the other hand, growth in the chip market is anticipated to provide a huge opportunity for OSAT companies.

The assembly segment was the largest revenue contributor in 2021, and is expected to grow at a CAGR of 6.46% from 2022 to 2031.

This is attributed to rise in need for effective supply chain management in the semiconductor manufacturing industry. By packaging type, the ball grid array segment was the leading largest contributor of revenue in 2020 and is expected to grow at a CAGR of 5.63% from 2022 to 2031. Technological advancements in the semiconductor industry has led to surge in demand for thinner and lighter electronics products.

Key Benefits For Stakeholders

  • This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the outsourced semiconductor assembly and testing market analysis from 2021 to 2031 to identify the prevailing outsourced semiconductor assembly and testing market opportunities.
  • The market research is offered along with information related to key drivers, restraints, and opportunities.
  • Porter’s five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
  • In-depth analysis of the outsourced semiconductor assembly and testing market segmentation assists to determine the prevailing market opportunities.
  • Major countries in each region are mapped according to their revenue contribution to the global market.
  • Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
  • The report includes the analysis of the regional as well as global outsourced semiconductor assembly and testing market trends, key players, market segments, application areas, and market growth strategies.

Key Market Segments

By Process

  • Sawing
  • Sorting
  • Testing
  • Assembly

By Packaging Type

  • Ball grid array
  • Chip scale package
  • Multi-package
  • Stacked die
  • Quad and dual

By Application

  • Automotive
  • Consumer electronics
  • Industrial
  • Telecommunication
  • Aerospace and defense
  • Medical and healthcare
  • Logistics and transportation

By Region

  • North America
  • U.S.
  • Canada
  • Mexico
  • Europe
  • UK
  • Germany
  • France
  • Italy
  • Russia
  • Sweden
  • Netherlands
  • Rest Of Europe
  • Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Rest Of Europe
  • LAMEA
  • Latin America
  • Middle East
  • Africa

Key Market Players

  • Advanced Silicon S.A.
  • Alphacore Inc.
  • Amkor Technology, Inc.
  • Device Engineering Inc.
  • Hidensity Group (Hmt Microelectronic Ag)
  • Presto Engineering Group
  • Sencio BV
  • Shortlink Group
  • Sifive, Inc. (Openfive)
  • Luminar Technologies, Inc. (Black Forest Engineering)

For more information about this report visit https://www.researchandmarkets.com/r/gn4yr6

 


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