Heraeus Electronics to Showcase Cutting-Edge Semiconductor Packaging Materials and Printed Electronics at SEMICON West
Heraeus Electronics is excited to announce its participation in SEMICON West, one of the most prominent global exhibitions for the semiconductor industry. The event will take place July 11-13, 2023, at the Moscone Center in San Francisco, California, where Heraeus Electronics will showcase its innovative range of semiconductor packaging materials and printed electronics.
As a pioneer in semiconductor packaging materials, Heraeus Electronics continues to drive advancements in the field, offering state-of-the-art solutions that push the boundaries of electronic manufacturing. At SEMICON West, attendees will have the opportunity to explore Heraeus Electronics’ cutting-edge products and technologies, including:
AgCoat® Prime: Heraeus introduces a real alternative to gold wire for the packaging industry. AgCoat® Prime is a silver alloy bonding wire coated with a layer of gold. Because AgCoat® Prime’s specifications are closely aligned to gold bonding wire, no inert gas is required, so no investment or changes to production equipment and facilities are necessary.
Welco AP520: This state-of-the-art water-soluble type 7 printing paste is designed to solve the challenges of miniaturization, as it can create tiny and reliable joints with close to zero defects. With excellent paste release down to 90 µm pitch, no splashing and best-in-class low void performance, AP520 makes an excellent choice for fine–pitch components and flip chip attach for next–generation System-in-Package applications used in 5G communications, smart-wearables, and electric vehicles.
AP500X: This water-soluble, halogen-free tacky flux is specifically engineered for ultra-fine bump-pitch flip chip attach and BGA attach applications. This new carefully designed flux plays an important part in eliminating defects such as cold joints, solder creeping, die shifting, voiding, underfill delamination, etc. in advanced semiconductor packages for high performance computing, memory, mobile and more.
Prexonics®: The Full System Solution by Heraeus Printed Electronics combines particle-free silver ink and an inkjet printer for superior EMI shielding using maskless selective coating. The full system solution offers perfectly matched equipment, silver ink, and processes to create the optimal shielding effectiveness, providing design flexibility. A complete one stop shop solution: High-speed inkjet printing system, particle-free silver ink, and curing system. The Prexonics solution provides excellent shielding performance for 2 µm conductive film with aspect ratio up to 1:1 at topside and sidewalls.
Printed Electronics Inks: Heraeus Electronics’ printed electronics inks are specifically formulated for specialty conductors, resistors and dielectrics serving applications up to 200°C. They enable the production of biomedical sensors, flexible terminations for high-reliability passive components, and other innovative electronic devices.
To learn more about Heraeus Electronics, visit www.heraeus-electronics.com.
About Heraeus
The Heraeus Group is a broadly diversified and globally leading family-owned technology company, headquartered in Hanau, Germany. The company’s roots go back to a family pharmacy started in 1660.Today, the Heraeus group includes businesses in the environmental, electronics, health and industrial applications sectors. Customers benefit from innovative technologies and solutions based on broad materials expertise and technological leadership.
In the 2021 financial year, the FORTUNE Global 500 listed group generated revenues of €29.5 billion (US$34.9 billion*) with approximately 16,200 employees in 40 countries. Heraeus is one of the top 10 family-owned companies in Germany and holds a leading position in its global markets.
About Heraeus Electronics
Heraeus Electronics is a leading manufacturer of materials for the assembly and packaging of devices in the electronics industry. The company develops material solutions for the automotive, power electronics and advanced semiconductor packaging market and offers its customers a broad product portfolio – from materials and material systems to services.
